Kofloc Model 5100 Mass Flow Controller features weldless structure, metal seals, an accuracy of ≤±1%, a response of ≤±1 second, and other basic performance conditions required for semiconductor process control, and additionally, has achieved a significant price reduction.

Materials of the parts in contact with gases:

Body: SUS316L
Diaphragm:
* Valve seat: PTFE
* Sealing: SUS316L, Ni, Au
* Option: SUS seal (SU), inner surface polish (KP)
Electric connection: 9-pin Dsub connector as per Standard KFC (Compliant with SEMI Standard)
Flow rate input signals: 0-5 VDC (Input impedance: 1 MΩ or more)
Flow rate output signals: 0-5 VDC (External load resistance: 250 kΩ or more)
Required power supply: +15 VDC (±5%) 100 mA, −15 VDC (±5%) 200 mA
Joint (Main unit bore) : Standard: 1/4 VCR equivalent Option: 1/4 SWL
Weight: Approx. 1000 g

Standard Specifications

Flow range(N2 equivalents, 06 ℃/1 atm): 1 SCCM – 20 SLM (The conditions are freely selectable)
Sensor: Thermal mass flow sensor
Valve type: Proportional solenoid valve (closed when not energized)
Control range: 2 – 100% (Porto)

Features

High accuracy and high response are achieved by the flow sen-sor with temperature-following current difference detection.
A normally-closed solenoid valve is employed.
A low leak rate is achieved by the weldless structure and metalseal.
The dead volume is reduced thanks to the diaphragm seat valve.
The face-to-face and body dimensions and the wiring tie-inpoints are designed to facilitate replacement of devices made by other companies.

Applications

Applicable gas：N2,Air,H2,He,Ar,O2,CO2 etc.
Air sampling
Analyzer component
Bioreactor
Biotechnological process
Burn control
CCFL manufacturing
Chamber pressure control
Chemical process
Environment monitoring
Electronic device manufacturing
Food production
Fuel cell testing
Fermentation process
Gas blending
Gas distribution
Gas flow monitoring
Gas generation
Industrial furnace
Leak testing
Pharmaceutical process
Pollution monitoring
Process flow control
R&D
Solar power element manufacturing
Secondary calibration reference
Semiconductor process
Surface treatment process
Thermal flame spray
Thin film manufacturing
Vapor deposition

Specifications

Flow range (N2 equivalent, 20℃/1 atm)	1 SCCM–20 SLM (The conditions are freely selectable)
Sensor	Thermal mass flow sensor
Valve type	Proportional solenoid valve (closed when not energized)
Control range	2–100% (F.S.)
Response	1 sec. or less (0–100% within ±2% typical)
Accuracy	±1% F.S. (Accuracy guaranteed at 15–35℃)
Repeatability	±0.2%F.S.
Operating differential pressure	F.S. ≤ 5 SLM: 50–300 kPa
	F.S. > 5 SLM: 100–300 kPa
	Option: Low differential pressure (LP) specification is available depending on conditions.
Allowable operating pressure	300 kPa (G) or less
Proof pressure	980 kPa (G)
Leak rate	1 × 10^-11 Pa·m³/s or less
Allowable ambient temperature	0–50℃
Allowable ambient humidity	10–90% (No condensation allowed)
Materials of parts in contact with gases	Body: SUS316L
	Diaphragm:SUS316L
	Valve seat: PTFE
	Sealing: SUS316L, Ni, Au
	Option: SUS seal (SU), inner surface polish (KP)
Electric connection	Dsub 9-pin connector as per KFC Standard (Compliant with SEMI Standard)
Flow rate input signals	0–5 VDC (Input impedance: 1 MΩ or more)
Flow rate output signals	0–5 VDC (External load resistance: 250 kΩ or more)
Required power supply	+15 VDC (±5%) 100 mA, −15 VDC (±5%) 200 mA
Joint (Main unit bore)	Standard: 1/4 VCR equivalent Option: 1/4 SWL
Weight	Approx. 1000 g

!!Note!!
Specifications relating to the flow range (e.g., flow range, accuracy and response) are expressed in N2 or air equivalent. The product will be built with the primary pressure of 300 kPa or less and the secondary side open to the atmosphere. For details on the pressure requirements, please contact us.